Designing for Performance, Portability and Price among Key Topics of 2005 Electronic Product Miniaturization Symposium; Cadence, IBM, PalmSource, Samsung and Others to Share Their Expertise in Meeting Next-Generation Product RequirementsSAN JOSE, Calif.—(BUSINESS WIRE)—June 21, 2005—
Tessera Technologies, Inc. (Nasdaq:TSRA), a leading
provider of miniaturization technologies for the electronics industry,
today provided further details of the agenda for its third annual
Technology Symposium which will be held at The Argent Hotel in San
Francisco, California. The symposium will take place on Monday, July
11, the day before the opening of SEMICON West 2005. Luminaries across
the semiconductor supply chain will explore the key technologies and
methodologies required to develop ultra-miniaturized, higher
performing electronics.
Dr. David Tuckerman, Tessera's chief technical officer, will open
the Symposium with a discussion on enabling a new generation of
miniaturized electronics. The following industry experts join
Tuckerman on the program:
-- Jon Kang, senior vice president of technical marketing at
Samsung, will explore how to achieve new levels of density
through package innovation.
-- Jonathan Hinkle, design engineer at IBM, will discuss advanced
packaging for blade servers.
-- Cadence's Felicia James, vice president, virtuoso platform,
will explore innovative RF tools for enhanced IC and
electronics design.
-- Mark Christensen, principal consultant, Prismark Partners,
will examine market trends, applications and analysis for
multiple-die packaging.
-- Dr. Tahir Cader, technical director, high performance
computing products group, Isothermal Systems Research (ISR),
will review enabling electronics, system and facility
densification with advanced SprayCool(TM) technology.
-- Charles White, senior director at Tessera, will discuss new
directions in IC packaging for wireless applications.
-- A panel of industry experts will explore the topic of the
future of electronics miniaturization. Is there a limit or are
the possibilities endless? Dr. David Tuckerman will moderate.
Panelists will include:
-- Daniel Rubin, general partner, Alloy Ventures
-- Tom Flynn, vice president of sales, Ansoft
-- Soudy Khan, director, product concept and user experience,
PalmSource
-- Jon Kang, senior vice president of technical marketing,
Samsung
-- Nick Colella, senior vice president, product
miniaturization division, Tessera
-- Gene Selven, publisher of Chip Scale Review, will provide
closing comments.
Tessera, Chip Scale Review and Semiconductor Manufacturing
Magazine have teamed to sponsor the Symposium. The half-day event will
run from 1:00-5:30 p.m., followed by a reception from 5:30-7:00 p.m.
As space will be limited, pre-registration is requested. The
registration fee is $55.00. Attendees can register at www.tessera.com.
For additional information, contact Daryl Larsen, symposium event
manager, at +1-408-952-4364 or dlarsen@tessera.com.
About Tessera, Inc.
Tessera Technologies, through its wholly-owned subsidiary Tessera,
Inc., is a leading provider of miniaturization technologies for the
electronics industry. Tessera enables new levels of miniaturization
and performance by applying its unique expertise in the electrical,
thermal and mechanical properties of materials and interconnect. As a
result, Tessera's technologies are widely adopted in high-growth
markets including consumer, computing, communications, medical and
defense. Tessera's customers include the world's top semiconductor
companies such as Intel, Samsung, Renesas, Toshiba and Texas
Instruments. The company's stock is traded on the Nasdaq National
Market under the symbol TSRA. Tessera is headquartered in San Jose,
California. www.tessera.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Factors that might cause or
contribute to such differences include, but are not limited to,
fluctuations in Tessera's operating results due to the timing of new
license agreements and royalties, Tessera's ability to protect its
intellectual property and the risk of a decline in demand for
semiconductor products. You are cautioned not to place undue reliance
on the forward-looking statements, which speak only as of the date of
this release. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended December 31, 2004, and its Quarterly Report on Form 10-Q filed
for the quarter ended March 31, 2005 include more information about
factors that could affect the company's financial results.
Note: Tessera and the Tessera logo are registered trademarks of
Tessera, Inc. All other company, brand and product names may be
trademarks or registered trademarks of their respective companies.
Contact:
Tessera Public Relations
Joyce Smaragdis, 510-338-0377
Email Contact
or
Porter Novelli, for Tessera
Ricky Gradwohl, 408-369-4600 x631
Email Contact
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